ADVANCED RESEARCH CORP.

TECHNOLOGY, Slice and Dice Wire Bonding, SiC, CERAMICS, Evaporation, Fine Wire and micro EDM, Gold Tin Eutectic, Exotic Materials Ceramics, Analytical, FILM, THIN, AFM MFM SPM, Optical CNC Measurement, Tools made house, Thermal Processing, FIB, NIST traceable standards, Flip Chip Services, SEM EDS, Sputtering, Grinding, Vacuum Chucks, and Failure Analysis, FPGAs DSPs SPICE, Flip Chip Tooling, Lapping and Polishing, Certified Associate Developer, Molds and Punches, Hybridization, Thin Film and Device Fab ARC, Devices Metallization, SET 150 Device Bonder, Lab View, Zerodur Glass, XRF, Custom Tooling, Sapphire, Profilometers, Precision Machining ARC, High Speed Milling, Robotics and Control Systems, Bumping, Ellipsometers, Embedded Systems, ray Apertures, MAGNETIC, FIB Editing, RECORDING, Indium Bumping