CENTERLINE

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CENTERLINE


Short profile:

Centerline Technologies provides ultra precision services for grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials for the telecommunication, semiconductor, communication, test measurement, micro electronic, defense and security industries

Keywords:

LAPPING, INDUSTRIES, sapphire optics, MACHINING, MICRO ELECTRONIC, MEASUREMENT, CMP, SEMICONDUCTOR, ceramics thinning, TUMBLING, polishing, technical, single crystal quartz, Dicing, superior quality, DIAMOND, edge polishing, SAWING, lapping substrates, ultra hard materials, sapphire lenses, optoelectronics materials, LASER, backgrinding, optical polishing, sapphire windows, polished substrates, ceramics dicing, wafer dicing, SHING, chemical mechanical polishing, sapphire wafer carriers, SERVING, DEFENSE, POLI, SECURITY, tolerances, sapphire substrates, fused silica, INCLUDING, polish, sapphire, Centerline Technologies

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